Crown Micro-Tech MT-1000 Informations techniques Page 22

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Micro-Tech 600/1200/2400 Power Amplifiers
5 Technical Information
5.1 Overview
Micro-Tech
amplifiers incorporate several technologi-
cal advancements including real-time computer simu-
lation of output transistor stress, low-stress output
stages and an advanced heat sink embodiment.
Custom circuitry is incorporated to limit temperature
and current to safe levels making it highly reliable and
tolerant of faults. Unlike many lesser amplifiers, it can
operate at its voltage and current limits without self-
destructing.
Micro-Tech
amplifiers are protected from all common
hazards that plague high-power amplifiers including
shorted, open or mismatched loads; overloaded power
supplies; excessive temperature, chain-destruction
phenomenon, input overload and high-frequency blow-
ups. The unit protects loudspeakers from input and
output DC, as well as turn-on and turn-off transients.
Real-time computer simulation is used to create an
analogue of the junction temperature of the output de-
vices (output transistors). Current is limited only when
the device temperature becomes excessive—and only
by the minimum amount required). This patented ap-
proach called Output Device Emulation Protection (or
ODEP
) maximizes the available output power and pro-
tects against overheating—the major cause of device
failure.
Crown also invented the four-quadrant topology used
in the output stages of each
Micro-Tech
amplifier (see
Figure 5.1). This special circuitry is called the
grounded
bridge
. It makes full use of the power supply by deliv-
ering peak-to-peak voltages to the load that are twice
the voltage seen by the output devices.
As its name suggests, the
grounded bridge
topology
is referenced to ground. Composite devices are con-
structed as gigantic NPN and PNP devices to handle
currents which exceed the limits of available devices.
Each output stage has two composite NPN devices
and two composite PNP devices.
The devices connected to the load are referred to as
“high-side NPN and PNP” and the devices connected
to ground are referred to as “low-side NPN and PNP.”
Positive current is delivered to the load by increasing
conductance simultaneously in the high-side NPN and
low-side PNP stage, while decreasing conductance of
the high-side PNP and low-side NPN.
The two channels may be used together to double the
voltage (Bridge-Mono) or current (Parallel-Mono) pre-
sented to the load. This feature gives you flexibility to
maximize power available to the load.
A wide bandwidth, multiloop design is used for state-
of-the-art compensation. This produces ideal behavior
and results in ultra-low distortion values.
Aluminum extrusions have been widely used for heat
sinks in power amplifiers due to their low cost and rea-
sonable performance. But measured on a watts per
pound or watts per volume basis, the extrusion tech-
nology doesn’t perform nearly as well as the heat sink
technology developed for
Micro-Tech
amplifiers.
The heat sinks in a
Micro-Tech
amplifier are fabricated
from custom convoluted fin stock that provides an ex-
tremely high ratio of area to volume, or area to weight.
All power devices are mounted directly to massive heat
spreaders that are electrically at the Vcc potential.
Making the heat spreaders electrically alive improves
thermal performance by eliminating the insulating in-
terface underneath each power device. The chassis
itself is also used as part of the thermal circuit to maxi-
mize utilization of the available resources.
5.2 Circuit Theory
Each channel is powered by its own power transformer
T100 or T200. Both channels share a common low-
voltage supply. The secondary output of T100 is full-
wave rectified by D109 and is filtered by a large
computer grade capacitor. A thermal switch embed-
ded in the transformer protects it from overheating.
The low-voltage fanformer is rectified by diodes D1,
D2, D3 and D4 to generate an unregulated 24 volts.
Monolithic regulators U1 and U2 provide a regulated
±15 volts.
5.2.1 Stereo Operation
For simplicity, the discussion of Stereo operation will
refer to one channel only. Mono operation will be dis-
cussed later. For specific circuit references, see the
block diagram in Figure 5.1 and the schematics pro-
vided at the back of this manual.
The signal at the ¼-inch phone jack input passes di-
rectly to the balanced gain stage (U104-A and
U104-B). The balanced gain stage causes balanced
to single-ended conversion using a difference ampli-
fier. From there, gain can be controlled with a potenti-
ometer. The error amp (U104-C) amplifies the
difference between the output signal and the input sig-
nal from the gain pot, and drives the voltage translator
stage.
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